Method and apparatus for transfering a wafer

In the present invention, a main chuck (15) comprises a table (15) for performing the delivery of a wafer (W) to and from a pincette (13) and a plurality of lift pins (20) for allowing the wafer (W) to rise from the surface of the table (15). At least one lift pin (20A) positioned on the side of the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	HYAKUDOMI, TAKANORI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CONVEYING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HANDLING THIN OR FILAMENTARY MATERIAL MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PACKING PERFORMING OPERATIONS PHYSICS PNEUMATIC TUBE CONVEYORS SEMICONDUCTOR DEVICES SHOP CONVEYOR SYSTEMS STORING TESTING TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	In the present invention, a main chuck (15) comprises a table (15) for performing the delivery of a wafer (W) to and from a pincette (13) and a plurality of lift pins (20) for allowing the wafer (W) to rise from the surface of the table (15). At least one lift pin (20A) positioned on the side of the pincette (13) is made longer and positioned higher than the other lift pins (20B, 20C) so as to permit the wafer (W) to be supported above the table (15) in an inclined manner.