Method of evaluating structural flaws on a wafer surface

Method of evaluating structural flaws on a wafer surface

The defect classification method compares a set of single fields (4) on a production wafer (1) with stored data from a reference wafer and classifies defects as critical or non critical.

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Bibliographische Detailangaben
1. Verfasser: WIENECKE, JOACHIM
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:The defect classification method compares a set of single fields (4) on a production wafer (1) with stored data from a reference wafer and classifies defects as critical or non critical.