Socket for BGA packages

A socket (11) for a BGA package (14) is provided which is of relatively simply construction and which provides reliable and efficient interconnection of a BGA package (14) and a printed circuit board (13). The socket (11) comprises a contact assembly (12) having an array of resilient conductive columns (32) having respective contact ends, the columns being mounted on a thin insulative sheet. The contact assembly (12) is supported on a frame (10) on insulating material and which has alignment posts for alignment of the contact assembly (12) to the frame and for alignment of the frame and mounted contact assembly to an associated circuit board (13). The frame (10) also includes latch elements for retaining the contact assembly on the frame. The socket (11) is mounted onto a printed circuit board (13) which has an array of contact areas corresponding to the array of resilient contacts of the socket. A BGA package (14) is placed onto the socket frame (10) and the package is maintained in alignment on the frame such that the ball contacts (40) engage the respective contacts of the contact assembly of the socket. The package (14) is retained in the socket (11) by a retention mechanism. The socket (11) can include elements for preventing overstress of the resilient contacts.