Apparatus and method for mounting electronic components

In the invention, there is provided an apparatus for mounting electronic components in which one or a plurality of mounting heads (7) pick up electronic components (24) from a plurality of component feeding units (3) for mounting the electronic components on a print circuit board, with assured pick-...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	KAWASHIMA, TOMIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	In the invention, there is provided an apparatus for mounting electronic components in which one or a plurality of mounting heads (7) pick up electronic components (24) from a plurality of component feeding units (3) for mounting the electronic components on a print circuit board, with assured pick-up and holding of the electronic components (24). The component feeding units (3) do not always have an identical pick-up position (10) among all the units (3) used in a mounting operation because of the variation in the manufacturing and the mounting of the units. The shift due to the variation along the direction of feeding, the Y direction, is corrected by moving the position of the nozzle (21) along the Y direction preferably with a controlled rotation of the mounting head (7) around an horizontal axis using the nozzle selection motor (22) for selecting the nozzle (21).