METHOD AND DEVICE FOR SIMULTANEOUSLY GRINDING DOUBLE SURFACES, AND METHOD AND DEVICE FOR SIMULTANEOUSLY LAPPING DOUBLE SURFACES

A double side simultaneous grinding (lapping) method and a double side simultaneous grinding (lapping) machine, in which a plate-like workpiece is held and ground (lapped) simultaneously for the both of front surface and back surface by using a pair of grinding stones (lapping turn tables) provided oppositely at both sides of the workpiece, wherein a relative position between the center of thickness of the plate-like workpiece and/or the center of holding means for holding the workpiece, and the center of space between stone (turn table) surf of the pair of grinding stones (lapping turn tables) is controlled to perform the grinding (lapping). According to the present invention, in the double side simultaneous grinding (lapping) by using the double side simultaneous grinding (lapping) machine, there can be provided the double side simultaneous grinding (lapping) method and the double side simultaneous grinding (lapping) machine, wherein generation of warpage of the plate-like workpiece is suppressed, degradation of warpage which may be generated due to the grinding (lapping) is prevented, and thereby the plate-like workpiece can be processed to have high flatness for the both sides, besides, the platd-like workpiece can be ground (lapped) while a degree of warpage is controlled so that it should be processed to have warpage of a desired degree.