Substrate processing system and method

The present invention generally provides a modular vacuum processing system which includes a mainframe supporting a transfer chamber, one or more load locks and process chambers mounted to the transfer chamber, a modular mainframe plumbing tray and chamber trays associated with the process chambers....

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YU, JAMES ENHAO, KUMAR, SHIV, BUCHNER, CHRIS, TEPMAN, AVI, KIM, DAEHWAN DANIEL, TODD, CRAIG B
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention generally provides a modular vacuum processing system which includes a mainframe supporting a transfer chamber, one or more load locks and process chambers mounted to the transfer chamber, a modular mainframe plumbing tray and chamber trays associated with the process chambers. Methods of processing substrates and sequencing substrates through the system are also provided.