Semiconductor module and inverter device

In a semiconductor module (109) comprising, a semiconductor element, an electrically insulating base (107) having an outer surface (107a) to be connected to an electrically grounded surface, and an inner surface (107b) on which the semiconductor element (4) is arranged, an electrically insulating co...

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Bibliographische Detailangaben
Hauptverfasser: TANAKA, AKIRA, SAITO, RYUICHI, KUSHIMA, TADAO, NONOYAMA, SIGEHARU, KOIKE, YOSHIHIKO, SIMIZU, HIDEO
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:In a semiconductor module (109) comprising, a semiconductor element, an electrically insulating base (107) having an outer surface (107a) to be connected to an electrically grounded surface, and an inner surface (107b) on which the semiconductor element (4) is arranged, an electrically insulating cover (2) covering the semiconductor element (4) on the inner surface (107b), and first and second electrically conductive members (201, 501, 601, 801, 901, 210, 510, 610, 810, 902) each of which is connected to the semiconductor element (4) and extends to the exterior of the semiconductor module (109) through the electrically insulating cover (2), a part (202, 211) of each of the first and second electrically conductive members (201, 501, 601, 801, 901, 210, 510, 610, 810, 902) on the exterior of the semiconductor module (109) is arranged away from the outer surface (107a) to electrically isolate the part (202, 211) of the each of the first and second electrically conductive members (201, 501, 601, 801, 901, 210, 510, 610, 810, 902) from the electrically grounded surface.