Integrated circuit assembly

Integrated circuit assembly

An integrated circuit assembly (10) includes a daughter die (22) stacked on top of a mother die (14). The upper surface of the mother die includes a number of conductive contact pads (26, 64), and the lower surface of the daughter die has a number of corresponding conductive contact pads (52, 64) re...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KELLY, MICHAEL G, BLEDSOE, JAMES DAREN, CROFT, DANIEL I
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An integrated circuit assembly (10) includes a daughter die (22) stacked on top of a mother die (14). The upper surface of the mother die includes a number of conductive contact pads (26, 64), and the lower surface of the daughter die has a number of corresponding conductive contact pads (52, 64) registered with and each electrically connected to a respective one of the contact pads of the mother die. The pads may be distributed to arbitrary locations, including away from the daughter die periphery. The circuit layers (32, 52) of the dies may face each other, and the dies may be connected by a conductive layer (56) or solder bumps (60).