Method and apparatus for cleaning workpiece

A semiconductor wafer (1) is scrubbed by a cleaning member (3) made primarily of polyurethane and having micropores in a surface contacting the semiconductor wafer. The micropores has an average diameter ranging from 10 to 200 mu m. The cleaning member (3) may be made of either polyurethane foam or...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AOKI, RIICHIRO, ONO, KOJI, KOUNO, GISUKE, MAEKAWA, TOSHIRO, MISHIMA, SHIRO, KODERA, MASAKO, OKADA, MOTOAKI, TAKAHASHI, TAMAMI, SHIGETA, ATSUSHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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