METHOD AND APPARATUS FOR PRODUCING BENEFICIAL STRESSES AROUND APERTURES BY THE USE OF FOCUSED STRESS WAVES

Tooling and a method of employing tooling to produce beneficial stress waves in a substrate to provide high fatigue life structures. Stress waves are provided to work a substrate, causing dimples in the workpiece, along a uniform pressure profile in the workpiece. By use of the method, uniform benef...

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Bibliographische Detailangaben
1. Verfasser:	EASTERBROOK, ERIC T
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMBINED OPERATIONS DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FORGE FURNACES FORGING GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS GRINDING HAMMERING MACHINE TOOLS MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS OTHER WORKING OF METAL PERFORMING OPERATIONS POLISHING PRESSING METAL PUNCHING METAL RIVETING TRANSPORTING UNIVERSAL MACHINE TOOLS WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
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Beschreibung
Zusammenfassung:	Tooling and a method of employing tooling to produce beneficial stress waves in a substrate to provide high fatigue life structures. Stress waves are provided to work a substrate, causing dimples in the workpiece, along a uniform pressure profile in the workpiece. By use of the method, uniform beneficial residual stress is provided at surface and midplane apertures in a workpiece, so as to improve overall fatigue life. An improved tool shape is described, having a smooth curve, rather than a flat punch. Also, the use of a consumable wafer provides additional uniform stress profile benefits.