Sputtering target and method of making same
There is disclosed a sputtering target comprising a body of metal such as aluminum and its alloy with an ultra-fine grain size and small second phase. Also described in a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a wo...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | There is disclosed a sputtering target comprising a body of metal such as aluminum and its alloy with an ultra-fine grain size and small second phase. Also described in a method for making an ultra-fine grain sputtering target comprising melting, atomizing, and depositing atomized metal to form a workpiece (60), and fabricating the workpiece (60) to form a sputtering target. A method is also disclosed that includes the steps of extruding a workpiece through a die having contiguous transverse inlet and outlet channels of substantially identical cross section, and fabricating the extruded article into a sputtering target. The extrusion may be performed several times, producing gain size of still smaller size and controlled grain texture. |
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