Cooling module including a pressure relief mechanism

The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MCDUNN, KEVIN J, BOWERS, MORRIS B
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACTUATING-FLOATS BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COCKS DEVICES FOR VENTING OR AERATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES TAPS THERMAL INSULATION IN GENERAL VALVES WEAPONS
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Beschreibung
Zusammenfassung:	The present invention provides a cooling module (100) and a method for forming the cooling module (100). The cooling module (100) is effective in reducing the temperature of heat-generating components mounted on the cooling module (100). The cooling module (100) includes a housing (105), a pressure relief mechanism (200), and a shearing surface (201). The housing (105) includes a cooling material (121) disposed therein. The pressure relief mechanism (200) is disposed within the housing (105) and covers the opening (203) to provide a seal that seals the housing (105). The shearing surface (201) is effective to break the seal upon exceeding a predetermined pressure within the housing (105).