Method and apparatus for fabricating a wafer spacing mask on a substrate support chuck

A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a central body (102) containing a plurality of apertures (108) that is positioned atop the workpiece support chuck and an outer ring shaped body (104) positioned on a flange of the workpiece s...

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Bibliographische Detailangaben
1. Verfasser:	FLANIGAN, ALLEN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method and apparatus for fabricating a wafer spacing mask on a workpiece support chuck. Such apparatus is a central body (102) containing a plurality of apertures (108) that is positioned atop the workpiece support chuck and an outer ring shaped body (104) positioned on a flange of the workpiece support chuck while material is deposited onto the apparatus and through the apertures onto chuck. Upon completion of the deposition process, the central body (102) and ring shaped body (104) are removed from the workpiece support chuck leaving deposits of the material to form the wafer spacing mask.