Method of manufacturing a contact for a vacuum switch

Method of manufacturing a contact for a vacuum switch

A contact piece (10,20) is pressed directly onto the surface of a contact carrier (1,2), leaving a gap along the contact surface. A solder material is arranged in regions directly adjoining the gap, between the contact piece and contact carrier. Under vacuum, the solder material is melted by heating...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIPPERTS, JERRIE, MEISSNER, JOHANNES, ROSSMANN, GERHARD, LIETZ, ALFREDO
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SWITCHES
ELECTRICITY
EMERGENCY PROTECTIVE DEVICES
RELAYS
SELECTORS
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Beschreibung
Zusammenfassung:A contact piece (10,20) is pressed directly onto the surface of a contact carrier (1,2), leaving a gap along the contact surface. A solder material is arranged in regions directly adjoining the gap, between the contact piece and contact carrier. Under vacuum, the solder material is melted by heating and the molten material penetrates the gap between the contact carrier and the contact piece.