Electronic component supply device
In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cu...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KUBOTA, SHUICHI KASHIWAZAKI, TAKAO KABESHITA, AKIRA TANINO, MASATO OKAWA, KOJI ENDO, TADASHI |
| description | In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cut into a tape pressing member (16), and a thin plate (18) which is provided to the front of the peel-away cutout portion (17) in the tape transfer direction. The thin plate (18) comprises an angled portion (19) having a rounded portion (20). A concavity (21), in which the thin plate (18) operates, is formed in the tape pressing member (16) downstream of the peel-away cutout portion (17) in the tape transfer direction. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP1014775B8</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP1014775B8</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP1014775B83</originalsourceid><addsrcrecordid>eNrjZFByzUlNLinKz8tMVkjOzy3Iz0vNK1EoLi0oyKlUSEkty0xO5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BhgaGJubmpk4WxkQoAQCP1CYL</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Electronic component supply device</title><source>esp@cenet</source><creator>KUBOTA, SHUICHI ; KASHIWAZAKI, TAKAO ; KABESHITA, AKIRA ; TANINO, MASATO ; OKAWA, KOJI ; ENDO, TADASHI</creator><creatorcontrib>KUBOTA, SHUICHI ; KASHIWAZAKI, TAKAO ; KABESHITA, AKIRA ; TANINO, MASATO ; OKAWA, KOJI ; ENDO, TADASHI</creatorcontrib><description>In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cut into a tape pressing member (16), and a thin plate (18) which is provided to the front of the peel-away cutout portion (17) in the tape transfer direction. The thin plate (18) comprises an angled portion (19) having a rounded portion (20). A concavity (21), in which the thin plate (18) operates, is formed in the tape pressing member (16) downstream of the peel-away cutout portion (17) in the tape transfer direction.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><creationdate>2006</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060927&DB=EPODOC&CC=EP&NR=1014775B8$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20060927&DB=EPODOC&CC=EP&NR=1014775B8$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUBOTA, SHUICHI</creatorcontrib><creatorcontrib>KASHIWAZAKI, TAKAO</creatorcontrib><creatorcontrib>KABESHITA, AKIRA</creatorcontrib><creatorcontrib>TANINO, MASATO</creatorcontrib><creatorcontrib>OKAWA, KOJI</creatorcontrib><creatorcontrib>ENDO, TADASHI</creatorcontrib><title>Electronic component supply device</title><description>In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cut into a tape pressing member (16), and a thin plate (18) which is provided to the front of the peel-away cutout portion (17) in the tape transfer direction. The thin plate (18) comprises an angled portion (19) having a rounded portion (20). A concavity (21), in which the thin plate (18) operates, is formed in the tape pressing member (16) downstream of the peel-away cutout portion (17) in the tape transfer direction.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2006</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByzUlNLinKz8tMVkjOzy3Iz0vNK1EoLi0oyKlUSEkty0xO5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BhgaGJubmpk4WxkQoAQCP1CYL</recordid><startdate>20060927</startdate><enddate>20060927</enddate><creator>KUBOTA, SHUICHI</creator><creator>KASHIWAZAKI, TAKAO</creator><creator>KABESHITA, AKIRA</creator><creator>TANINO, MASATO</creator><creator>OKAWA, KOJI</creator><creator>ENDO, TADASHI</creator><scope>EVB</scope></search><sort><creationdate>20060927</creationdate><title>Electronic component supply device</title><author>KUBOTA, SHUICHI ; KASHIWAZAKI, TAKAO ; KABESHITA, AKIRA ; TANINO, MASATO ; OKAWA, KOJI ; ENDO, TADASHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP1014775B83</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2006</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KUBOTA, SHUICHI</creatorcontrib><creatorcontrib>KASHIWAZAKI, TAKAO</creatorcontrib><creatorcontrib>KABESHITA, AKIRA</creatorcontrib><creatorcontrib>TANINO, MASATO</creatorcontrib><creatorcontrib>OKAWA, KOJI</creatorcontrib><creatorcontrib>ENDO, TADASHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUBOTA, SHUICHI</au><au>KASHIWAZAKI, TAKAO</au><au>KABESHITA, AKIRA</au><au>TANINO, MASATO</au><au>OKAWA, KOJI</au><au>ENDO, TADASHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic component supply device</title><date>2006-09-27</date><risdate>2006</risdate><abstract>In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cut into a tape pressing member (16), and a thin plate (18) which is provided to the front of the peel-away cutout portion (17) in the tape transfer direction. The thin plate (18) comprises an angled portion (19) having a rounded portion (20). A concavity (21), in which the thin plate (18) operates, is formed in the tape pressing member (16) downstream of the peel-away cutout portion (17) in the tape transfer direction.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP1014775B8 |
| source | esp@cenet |
| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS |
| title | Electronic component supply device |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-11T03%3A53%3A19IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUBOTA,%20SHUICHI&rft.date=2006-09-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP1014775B8%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |