Electronic component supply device

In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cu...

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Bibliographische Detailangaben
Hauptverfasser:	KUBOTA, SHUICHI, KASHIWAZAKI, TAKAO, KABESHITA, AKIRA, TANINO, MASATO, OKAWA, KOJI, ENDO, TADASHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS
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Beschreibung
Zusammenfassung:	In an electronic component supply device wherein electronic components are accommodated within cavities formed in a carrier tape of which surface is covered with a top tape, a peeling portion (12) for peeling off the top tape (5) from the carrier tape (1) comprises a peel-away cutout portion (17) cut into a tape pressing member (16), and a thin plate (18) which is provided to the front of the peel-away cutout portion (17) in the tape transfer direction. The thin plate (18) comprises an angled portion (19) having a rounded portion (20). A concavity (21), in which the thin plate (18) operates, is formed in the tape pressing member (16) downstream of the peel-away cutout portion (17) in the tape transfer direction.