Apparatus for protecting a substrate support surface and method of fabricating same

A ceramic substrate chuck having a protective coating (100) and spacing mask (110) deposited upon a support surface (102) thereof and a method of fabricating same. The protective coating (100) is fabricated of a leaky dielectric material, such materials include oxides and nitrides such as Si3N4, SiO...

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Bibliographische Detailangaben
Hauptverfasser:	XU, ZHENG, TZOU, EUGENE, PARKHE, VIJAY
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A ceramic substrate chuck having a protective coating (100) and spacing mask (110) deposited upon a support surface (102) thereof and a method of fabricating same. The protective coating (100) is fabricated of a leaky dielectric material, such materials include oxides and nitrides such as Si3N4, SiO2, Si-O-N, BN, diamond, Al2O3, and aluminosilicates. The protective coating (100) and spacing mask (110) is formed upon the support surface (102) using one of a variety of material deposition techniques including chemical vapor deposition (CVD), plasma enhanced CVD, sputtering, flame spraying, and the like. Prior to deposition of the protective coating (100), a layer of the surface of the ceramic substrate support can be removed to reduce or prevent contaminants from being sealed between the support surface (102) and the protective coating (100). The protective coating (100) of the present invention results in a substantial decrease in contamination of ceramic chucks, wafers and the process chamber environment. The protective coating (100) does not significantly interfere with the clamping process or impact the clamping force that retains the wafer (112) upon the electrostatic chuck (104).