Process for avoiding the inclusion of bubbles during the joining by adhesives of optical data carrier substrates

For the adhesive bonding of substrates (1), at an optical data carrier, an electrical charge is applied to one and/or the other substrate (1) and/or the adhesive. The electrical charge is applied to the disk substrate (1) before or after the adhesive is in place, with an opposite or identical polari...

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Bibliographische Detailangaben
Hauptverfasser:	SICHMANN, EGGO, MUECKE, MICHAEL, GERIGK, REINHARD
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS PHYSICS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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