Process for avoiding the inclusion of bubbles during the joining by adhesives of optical data carrier substrates

For the adhesive bonding of substrates (1), at an optical data carrier, an electrical charge is applied to one and/or the other substrate (1) and/or the adhesive. The electrical charge is applied to the disk substrate (1) before or after the adhesive is in place, with an opposite or identical polarity to that at the adhesive. The disk substrate (1) is treated to make it electrically neutral, before or after the application of the adhesive. The adhesive has a positive or negative polarity, or is earthed. The adhesive is charged or earthed at its delivery jet. The electrical charge is applied through an electrical field, or through the electron emissions of a corona discharge. The charge can also be by friction. A charging comb (2) can be used., at a gap (d) of 10-50 mm from the substrate (1), and pref. 30 mm. The charging comb (2) and the substrate (1) are moved against each other where the substrate (1) is rotated under a fixed charging comb (2) or vice versa. The substrate (1) surface is given a homogenous electrical charge distribution according to at least one of the parameters of substrate material, adhesive material, temp. and moisture. A substrate is given an electrical charge before it is in contact with the adhesive at the other substrate. The electrical charge is applied to the substrate (1) surface towards the adhesive or opposite the adhesive, before or after the adhesive is in place. At least one substrate (1) rotates on a rotary plate (3) opposite the charging comb (2).