IC card housing and method of manufacture

A method is provided for manufacturing a housing (10) for containing an IC card (12). The method includes the steps of stamping a pair of metal covers (16,20) with at least one of the covers having a continuous uninterrupted edge (32) provided with a plurality of through holes (34) spaced inwardly o...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	KEANE, MIKE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS HANDLING RECORD CARRIERS INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED CIRCUITS PUNCHING METAL RECOGNITION OF DATA RECORD CARRIERS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS ORPROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method is provided for manufacturing a housing (10) for containing an IC card (12). The method includes the steps of stamping a pair of metal covers (16,20) with at least one of the covers having a continuous uninterrupted edge (32) provided with a plurality of through holes (34) spaced inwardly of and along the edge. The covers are placed into a mold for an injection molding process. Plastic support members (18,22,24) are injected into the mold into attachment with the covers. Plastic material of the support member surrounds the edge and flows through the holes of the cover. The covers and attached support members are removed from the mold, and the support members are bonded together so that a housing (10) is formed with the covers and within which the IC card can be contained.