Plasma method for depositing surface layers

The invention relates to a method for obtaining a surface layer on a substrate by means of a PACVD plasma generated with the aid of a gas, the substrate being connected to a bipolar voltage source which supplies periodic bipolar voltage pulses, characterized in that the absolute value of the amplitu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	MENEVE, JAN, DEKEMPENEER, ERIK, SMEETS, JOS
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The invention relates to a method for obtaining a surface layer on a substrate by means of a PACVD plasma generated with the aid of a gas, the substrate being connected to a bipolar voltage source which supplies periodic bipolar voltage pulses, characterized in that the absolute value of the amplitude of the voltage during the positive voltage pulse is smaller than the absolute value of the amplitude of the voltage during the negative voltage pulse.