Sputtering control system

A method of reactive sputter coating a layer of a compound, the method comprising: sputtering a target in a reactive atmosphere; monitoring a first process parameter; modifying, in a first control loop, a system input in response to the first process parameter; monitoring a second process parameter;...

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Bibliographische Detailangaben
Hauptverfasser:	GIBBONS, KEVIN, TERRY, ROBERT, ZARRABIAN, SOHRAB
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of reactive sputter coating a layer of a compound, the method comprising: sputtering a target in a reactive atmosphere; monitoring a first process parameter; modifying, in a first control loop, a system input in response to the first process parameter; monitoring a second process parameter; and modifying, in a second control loop, a second system input in response to the second process parameter.