A method of manufacturing an integrated circuit using chemical mechanical polishing and a chemical mechanical polishing system

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Bibliographische Detailangaben
Hauptverfasser:	MAZE, JOHN ALBERT (III), SOWELL, JOHN THOMAS, EASTER, WILLIAM GRAHAM, CREVASSE, ANNETTE MARGARET
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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