Ceramic substrate having a metal circuit

A substrate having a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise the following first metal-second metal bonded product (except for a combination of the same kinds of metals of the first meta...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAMURA, MIYUKI, FUSHII, YASUHITO, TSUJIMURA, YOSHIHIKO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A substrate having a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise the following first metal-second metal bonded product (except for a combination of the same kinds of metals of the first metal and the second metal) and/or the following first metal-third metal-second metal bonded product, and the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components, second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components, and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), Zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.