HIGH DENSITY COMPOSITE MATERIAL

The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, f...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DINGUS, MICHAEL, L, MUSKOPF, BRIAN, A, BRAY, ALAN, V
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention is related to a family of materials that may act as a replacement for lead in applications where the high density of lead is important, but where the toxicity of lead is undesirable. The present invention more particularly provides a high density material comprising tungsten, fiber and binder. Methods and compositions of such materials and applications thereof are disclosed herein.