Power semiconductor device module with submodules having integrated coolers

The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a...

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Hauptverfasser: ETTER, PETER, STUCK, ALEXANDER, ZEHRINGER, RAYMOND
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Sprache:eng ; fre ; ger
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creator ETTER, PETER
STUCK, ALEXANDER
ZEHRINGER, RAYMOND
description The module (1) has a number of sub-modules (2) with at least one semiconducting chip (3) attached to the top of an electrically insulating, heat conducting substrate (6) with a thermal expansion coefficient matching that of the chip. One sub-module (2) directly in the substrate has a cooler (7) of a good thermal conductor. The cooler is embedded in the underside (6b) of the substrate.
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title Power semiconductor device module with submodules having integrated coolers
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