Heat-sensitive composition for making a lithographic printing form precursor

There is described coated on a lithographic base a complex of a developer-soluble phenolic resin and a compound which forms a thermally frangible complex with the phenolic resin. This complex is less soluble in the developer solution than the uncomplexed phenolic resin. However when this complex is...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MONK, ALAN STANLEY VICTOR, PARSONS, GARETH RHODRI, RILEY, DAVID STEPHEN, HOARE, RICHARD DAVID
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COLOUR PRINTING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTROGRAPHY HOLOGRAPHY LINING MACHINES MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING,INKING, DAMPING, OR THE LIKE MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM PRINTING PRINTING PLATES OR FOILS PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTINGSURFACES STAMPS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TYPEWRITERS USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	There is described coated on a lithographic base a complex of a developer-soluble phenolic resin and a compound which forms a thermally frangible complex with the phenolic resin. This complex is less soluble in the developer solution than the uncomplexed phenolic resin. However when this complex is imagewise heated the complex breaks down so allowing the non-complexed phenolic resin to be dissolved in the developing solution. Thus the solubility differential between the heated areas of the phenolic resin and the unheated areas is increased when the phenolic resin is complexed. Preferably a laser-radiation absorbing material is also present on the lithographic base. A large number of compounds which form a thermally frangible complex with the phenolic resin have been located. Examples of such compounds are quinolinium compounds, benzothiazolium compounds, pyridinium compounds and imidazoline compounds.