Flip chip packaging of memory chips

Flip chip packaging of memory chips

The specification describes an interconnect strategy for memory chip packages to reduce or eliminate alpha particle contamination from the use of high lead solder interconnections in the vicinity of semiconductor memory cells. In the primary embodiment a high tin solder is recommended. A multi-layer...

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Hauptverfasser: TAI, KING LIEN, DEGANI, YINON, DUDDERAR, THOMAS DIXON
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TAI, KING LIEN
DEGANI, YINON
DUDDERAR, THOMAS DIXON
description The specification describes an interconnect strategy for memory chip packages to reduce or eliminate alpha particle contamination from the use of high lead solder interconnections in the vicinity of semiconductor memory cells. In the primary embodiment a high tin solder is recommended. A multi-layer under bump metallization is described that is compatible with high tin solders and flip-chip solder bump technology.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Flip chip packaging of memory chips
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