OPTICAL CIRCUIT ON PRINTED CIRCUIT BOARD

Apparatus for packaging a fiber optic device along with electronic and opto-electronic components upon a printed circuit board. Bend members having arcuate shaped guide surfaces for directing fibers between various components are strategically mounted upon the top surface of the board. Passive fiber...

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Bibliographische Detailangaben
Hauptverfasser:	DEMERITT, JEFFRY, A, SCHMIDT, GERALD, B, JAKOBSON, PAUL, A, WALKER, ROBERT, J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES USING STIMULATED EMISSION ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Apparatus for packaging a fiber optic device along with electronic and opto-electronic components upon a printed circuit board. Bend members having arcuate shaped guide surfaces for directing fibers between various components are strategically mounted upon the top surface of the board. Passive fiber optic components are also mounted upon support means between bend members so that the fibers entering and exiting the passive component run tangent to the bend radius of the bend members. The radius of curvature of the bend members is within the bend tolerance of the fibers used in the device. The bend members and support members are formed of a material having a thermal coefficient of expansion that is about equal to that of the board material whereby thermally induced stresses on the board mounted components are minimized.