Structure to effect adhesion between subtrate and ink barrier in ink jet printhead

A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer (60, 63) of a thin film substrate and a polymer ink barrier layer (12) in the vicinity of ink chambers (19) formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide lay...

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Hauptverfasser: KEEFE, BRIAN J, EMAMJOMEH, ALI, CHAPMAN, TERRI I, KOLODZIEJ, ROGER J, FIGUEREDO, DOMINGO A, WEBSTER, GRANT ALLEN, HINDMAN, GREGORY T
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A thermal ink jet printhead that includes an adhesion interface between a silicon carbide layer (60, 63) of a thin film substrate and a polymer ink barrier layer (12) in the vicinity of ink chambers (19) formed in the polymer ink barrier layer, and an adhesion interface between a silicon carbide layer (14) disposed on the ink barrier layer and an orifice plate (13). An intervening adhesion promoter (64, 65, 15) can be located between the silicon carbide layer of the thin film substrate and the polymer ink barrier layer, and between the silicon carbide layer disposed on the ink barrier layer and the orifice plate.