Adhesive sheet for wafer setting and process for producing electronic components

Adhesive sheet for wafer setting and process for producing electronic components

An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part, wherein the marginal part has an antiexpansibility greater than that of the wafer setting part. This enables...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NODE, SHUNSAKU, SUGINO, TAKASHI, SENOO, HIDEO
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:An adhesive sheet for wafer setting, comprising a wafer setting part composed of an expansible film and an adhesive layer for wafer setting and a marginal part outside the wafer setting part, wherein the marginal part has an antiexpansibility greater than that of the wafer setting part. This enables secure expansion in a process for producing an electronic component.