Process for bonding a diamon substrate to at least one metallic substrate

The method of bonding a diamond substrate to a metal substrate involves (a) subjecting a diamond substrate, covered with aluminium foil on one or both faces, to thermocompressive bonding under argon or vacuum to form a composite multilayer substrate; (b) placing the or each aluminium surface of the...

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Bibliographische Detailangaben
Hauptverfasser:	RANCHY, ERIC, PETITBON, ALAIN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMBINED OPERATIONS COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER WORKING OF METAL PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TRANSPORTING TREATMENT OF NATURAL STONE UNIVERSAL MACHINE TOOLS
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Beschreibung
Zusammenfassung:	The method of bonding a diamond substrate to a metal substrate involves (a) subjecting a diamond substrate, covered with aluminium foil on one or both faces, to thermocompressive bonding under argon or vacuum to form a composite multilayer substrate; (b) placing the or each aluminium surface of the multilayer substrate in contact with a metal substrate; and (c) carrying out a second thermocompressive bonding operation.