Electronic component package with decoupling capacitors completely within die receiving cavity of substrate

Electronic component package with decoupling capacitors completely within die receiving cavity of substrate

An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CAPPO, FRANCIS F., JR, BROFMAN, PETER JEFFREY, KNICKERBOCKER, SARAH HUFFSMITH, FRANKEL, JASON LEE, BIRD, KENNETH ALFRED, KADAKIA, SURESH DAMODARDAS, SIKORSKI, SCOTT ANTHONY
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic component package comprising a substrate having at least one die-receiving cavity formed therein, the cavity being defined by a die-receiving surface and an inner sidewall having a terraced contour, the substrate having an exterior surface bordering the cavity perimeter, the inner sidewall extending between the die-receiving surface and the substrate exterior surface, and at least one capacitor positioned completely within the cavity and mounted to one of the terraces of the inner sidewall.