Printed circuit board, IC card, and manufacturing method thereof
In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period in low cost without requiring a complex manufacturing step. A conductive material is pattern-printed on a base board (1) and the p...
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| creator | SASAKI, HIDEAKI KAZUI, SHINICHI FUJIKAWA, KEIJI SHIRAI, MITSUGU MATSUOKA, MAKOTO |
| description | In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period in low cost without requiring a complex manufacturing step. A conductive material is pattern-printed on a base board (1) and the printed conductive material is hardened to form a first conductor layer (2). Subsequently, an insulating material is pattern-printed on the first conductor layer (2), and the printed insulating material is hardened to thereby form a first insulating layer (3). A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer (4), a second insulating layer (5), and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Printed circuit board, IC card, and manufacturing method thereof |
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