Printed circuit board, IC card, and manufacturing method thereof

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period in low cost without requiring a complex manufacturing step. A conductive material is pattern-printed on a base board (1) and the printed conductive material is hardened to form a first conductor layer (2). Subsequently, an insulating material is pattern-printed on the first conductor layer (2), and the printed insulating material is hardened to thereby form a first insulating layer (3). A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer (4), a second insulating layer (5), and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.