Semiconductor wafer post-polish clean and dry method and apparatus

Method for polishing a semiconductor wafer (12) including the steps of mounting a first face (22) of the wafer (12) on a polishing block (14), attaching the polishing block (14) to a wafer polisher (16) such that a second face (24) of the wafer (12) is exposed to a polishing pad (19) of the wafer polisher (16) for polishing the second face (24) of the wafer (12), polishing the exposed second face (24) of the wafer (12) using the polishing pad (19) of the polishing device (16). The method further includes transferring the polishing block (14) and wafer (12) as a unit (15) after polishing to a cleaning and drying station (10). The polishing block (14) and wafer unit (15) are oriented in the cleaning and drying station (10) so that the second face (24) is accessible for cleaning. Cleaning liquid is delivered to the exposed second face (24) of the wafer (12) for a first selected time to clean particulate matter left after polishing from the exposed second face (24) of the wafer (12). The polishing block (14) and wafer unit (15) is rotated for a second time and at a rate selected to throw liquid off of the second face (24) of the wafer (12) for drying the wafer (12). Apparatus (10) for cleaning and drying a polishing block (14) and wafer unit (15) immediately following polishing is also disclosed.