Chip carrier and semiconductor device using the same
A carrier substrate (108) comprises a flexible insulating substrate (101) containing aramid fiber as a reinforcer, first bonding pads (102) formed on one side of the flexible insulating substrate (101), and second bonding pads (105) formed on the other side of the flexible insulating substrate (101)...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | A carrier substrate (108) comprises a flexible insulating substrate (101) containing aramid fiber as a reinforcer, first bonding pads (102) formed on one side of the flexible insulating substrate (101), and second bonding pads (105) formed on the other side of the flexible insulating substrate (101), where the first bonding pads (102) and the second bonding pads (105) are electrically bonded by via-holes (103) punched in the flexible insulating substrate (101). The carrier substrate (108) and a peripheral stiffener (106) made of a material whose thermal expansion coefficient is higher than that of the carrier substrate (108) compose a chip carrier, and an LSI chip (201) is mounted on the recess of the chip carrier. |
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