Substrate on which bumps are formed and method of forming the same

A bi-layer bump (6) comprises a base layer (5a) composed of sprayed aluminum thick film having a thickness of about 20 mu m formed to cover the periphery of a passivation film (3) formed on each pad electrode (2), and a surface layer (5b) composed of sprayed copper thick film having a thickness of about 30 mu m formed on the base layer (5a). According to the above-mentioned structure, a substrate on which bumps are formed having excellent electrical properties, connecting reliability, and enabling an interlayer insulating layer, an active layer and a multi-layer wiring to be provided under the pad electrode, can be obtained.