SOLVENT-BONDING FOIL AND NON-PVC-BASED MOULDING COMPOUND
The present invention relates to a moulding compound containing a polymer composed of the monomer ethylene and at least one co-monomer selected from the group consisting of vinyl esters of a C2 to C3 alkane carboxylic acid and C1 to C4 alkyl esters of acrylic acid, in which the proportion of co-mono...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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