SOLVENT-BONDING FOIL AND NON-PVC-BASED MOULDING COMPOUND

The present invention relates to a moulding compound containing a polymer composed of the monomer ethylene and at least one co-monomer selected from the group consisting of vinyl esters of a C2 to C3 alkane carboxylic acid and C1 to C4 alkyl esters of acrylic acid, in which the proportion of co-mono...

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Bibliographische Detailangaben
1. Verfasser:	KLAAR, KARLO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention relates to a moulding compound containing a polymer composed of the monomer ethylene and at least one co-monomer selected from the group consisting of vinyl esters of a C2 to C3 alkane carboxylic acid and C1 to C4 alkyl esters of acrylic acid, in which the proportion of co-monomer is at least 27 wt.%. The moulding compound also contains a polyolefine or a mixture of several polyolefines in a proportion of at least 10 wt.%. of the moulding compound. The THF extract to DIN 53738 with an extraction time of 4 h is greater than 35 %. The moulding compound is used to produce solvent-bonding foils and sealing webs, especially by calendering.