Signal isolating microwave splitters/combiners

A microwave arrangement (CB1), such as a splitter and combiner, is formed by sandwiching a conductive ground plane (GP1) between two dielectric microstrip boards (DB1, DB2) whose outer faces carry RF traces (MT1, MT11, MT12, MT13, MT2, MT21, MT22, MT23, MT31, MT32, MT33) and extending the ground pla...

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Bibliographische Detailangaben
1. Verfasser:	ANDRY, STEVEN C
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS WAVEGUIDES
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Beschreibung
Zusammenfassung:	A microwave arrangement (CB1), such as a splitter and combiner, is formed by sandwiching a conductive ground plane (GP1) between two dielectric microstrip boards (DB1, DB2) whose outer faces carry RF traces (MT1, MT11, MT12, MT13, MT2, MT21, MT22, MT23, MT31, MT32, MT33) and extending the ground plane with a conductive plurality of distributed via holes (VH2) that contact the ground plane and pass through the boards to their outer faces. Connections are made between the traces on the surfaces with additional conductive via holes (VH1) that pass through the ground plane where the ground plane forms openings for passage of the via holes.