Device for coating substrates in vacuum

Apparatus for sputter coating substrates (14) consists of an alternating current source (2) connected to two cathodes (6,7) located in a coating chamber (15) capable of being evacuated. The cathodes are connected to targets whose sputtered particles are coated onto the substrate. A process gas is pa...

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Bibliographische Detailangaben
Hauptverfasser: SZCZYRBOWSKI, JOACHIM, TESCHNER, GOETZ
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Apparatus for sputter coating substrates (14) consists of an alternating current source (2) connected to two cathodes (6,7) located in a coating chamber (15) capable of being evacuated. The cathodes are connected to targets whose sputtered particles are coated onto the substrate. A process gas is passed through the chamber. A network circuit (1) is located between the chamber and the current source and consists of a transformer (3), coils (5,12,13) and capacitors (4,8,9,10,11). The circuit operates in such a way that the cathode resistance and cathode power are at a point (A) which is slightly away from the max. power value (M).