COPPER-TUNGSTEN ALLOYS AND PROCESS FOR PRODUCING THE SAME

Copper-tungsten alloys comprising on the weight basis 5-30 % copper, 0.002-0.04 % phosphorus and the balance substantially consisting of tungsten, and preferably containing 0.1-0.5 % of one or more members selected among cobalt, nickel and iron. The alloys are used as electrode materials, contact ma...

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Bibliographische Detailangaben
Hauptverfasser:	AKIYOSHI, NAOYOSHI, KODA, KATSUMI, NAKAYAMA, MASAO, YAMABE, HIROYUKI, NAKADA, KIMIO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC SWITCHES ELECTRICITY EMERGENCY PROTECTIVE DEVICES FERROUS OR NON-FERROUS ALLOYS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY PERFORMING OPERATIONS POWDER METALLURGY RELAYS SELECTORS SEMICONDUCTOR DEVICES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	Copper-tungsten alloys comprising on the weight basis 5-30 % copper, 0.002-0.04 % phosphorus and the balance substantially consisting of tungsten, and preferably containing 0.1-0.5 % of one or more members selected among cobalt, nickel and iron. The alloys are used as electrode materials, contact materials, semiconductor packaging materials, heat sinks, and so forth.