Arrangement for mounting an optoelectronic device on a carrier

The arrangement has a jointing material (3) which is arranged between the carrier (1) and the optoelectronic component (2) and which is made in the viscous or liquid state, whereby the carrier has a coating (8) contg. the jointing material and the side of the component facing the carrier has a film...

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Bibliographische Detailangaben
Hauptverfasser:	SCHOLZ, WERNER., KUKE, ALBRECHT.DR, HAUER, HEINER, MOESS, EBERHARD, FRITSCHER, RAIMUND.
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The arrangement has a jointing material (3) which is arranged between the carrier (1) and the optoelectronic component (2) and which is made in the viscous or liquid state, whereby the carrier has a coating (8) contg. the jointing material and the side of the component facing the carrier has a film (6) contg. the jointing material. Grooves (7,7') in the carrier on either side of the component have walls which can be coated with film contg. the jointing material. The separation of the grooves is not greater than the width of the component by more than thickness of the jointing material between the coating and the film, or the separation of the grooves is smaller than the width of the component.