Optical fiber array/optical integrated circuit interconnection assembly and enclosures for protecting the interconnection assembly

The invention includes an interconnection assembly for coupling optical fibers to respective optical waveguides of an optical integrated circuit (OIC). The interconnection assembly includes an OIC assembly preferably formed by adhering a protective plate to a substrate on which the OIC and its optical waveguides are integrated. In one end of the OIC assembly, ends of the optical waveguides are exposed. Importantly, the protective plate and the substrate have substantially similar thermal coefficients of expansion to reduce or eliminate stresses or strains on the adhesive when the interconnection assembly is subjected to temperature and/or humidity conditions that are different from those under which the interconnection assembly was formed. The interconnection assembly also includes an optical fiber array that houses end portions of the optical fibers. The optical fiber array includes first and second parts between which are situated the end portions of the optical fibers in a spaced, parallel relationship corresponding to the spacing of the ends of the optical waveguides of the OIC assembly. The first and second parts have substantially similar thermal coefficients of expansion to reduce or eliminate stresses or strains on the adhesive layer holding the first and second parts together. The OIC assembly is joined to the optical fiber array with an adhesive so that the optical fibers are aligned with the optical waveguides of the OIC assembly. The invention also includes enclosures for housing and protecting the interconnection assembly.