Rework process for semiconductor chips mounted on an organic substrate

A rework process for semiconductor chips mounted in a flip chip configuration, via solder balls, on an organic substrate is disclosed, comprising the steps of: heating the solder regions to at least a relatively low second melting temperature, removing the defective chip, removing substantially all of the solder regions remaining on the contact pads of said organic substrate, applying a pre-selected amount of solder having said second melting temperature to each of said contact pads, bringing a plurality of solder regions attached to contact pads of a functional semi-conductor chip and having a first relatively high melting temperature into contact with the solder applied to said contact pads of said organic substrate, and heating said solder applied to said contact pads of said organic substrate to said second melting temperature.