leadframe and method of fabrication
The leadframe (10) includes a semiconductor device mounting area (12), and a number of electrically conductive leads. The mounting area is formed of a metal impregnated silicon carbide. The conductive leads are comprised of a metal coupled to the mounting area. The conductive lead metal may be alumi...
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| Format: | Patent |
| Sprache: | eng ; fre ; ger |
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| Zusammenfassung: | The leadframe (10) includes a semiconductor device mounting area (12), and a number of electrically conductive leads. The mounting area is formed of a metal impregnated silicon carbide. The conductive leads are comprised of a metal coupled to the mounting area. The conductive lead metal may be aluminum. The thermal expansion of the mounting area is similar to that of gallium arsenide or silicon. |
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