Printed circuit boards with selectively filled plated through holes

Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board (1) has two types of plated through holes. The first type of plated through holes (7a) extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-th...

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Bibliographische Detailangaben
Hauptverfasser:	MARKOVICH, VOYA RISTA, PAPATHOMAS, KONSTANTINOS, MAGNUSON, ROY HARVEY, BHATT, ANILKUMAR CHINUPRASAD, POWELL, DOUGLAS OLIVER
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Disclosed is a printed circuit board and a method of preparing the printed circuit board. The printed circuit board (1) has two types of plated through holes. The first type of plated through holes (7a) extend to and through an exterior surface of the printed circuit board for receipt of a pin-in-through-hole module or component pin. The second type of plated through holes (7b) are for surface mount technology and terminate below the exterior surface of the printed circuit board. These plated through holes contain a fill composition (11).