Moisture-curable hot melt pressure sensitive adhesives

A moisture-curable silicone hot melt pressure-sensitive adhesive composition is disclosed, said composition comprising: (A) a solid alkoxy functional organopolysiloxane resin containing curing radicals of the formula -ZSiR x(OR )3-x; wherein R is a monovalent hydrocarbon radical, R is selected from alkyl radical or alkoxyalkyl radical, Z is a divalent linking radical, and the subscript x has a value of 0 or 1; (B) a diorganopolysiloxane polymer, each terminal group thereof containing at least one silicon-bonded hydrolyzable functional radical selected from the group consisting of alkoxy radicals having 1 to 4 carbon atoms, ketoxime radicals, aminoxy radicals, acetamido radicals, N-methylacetamido radicals and acetoxy radicals; said polymer having a viscosity at 25 DEG C. of 20 to 100,000 mm /s, and the weight ratio of said resin to said polymer being in the range 40:60 to 80:20; and (C) sufficient catalyst to accelerate the cure of said composition; said composition being an essentially solvent-free, non-slump solid at room temperature which cures to an essentially non-tacky elastomer upon exposure to moisture.