HEAT-RESISTANT ADHESIVE FILM FOR PRINTED BOARD AND METHOD OF USE THEREOF

A heat-resistant adhesive film for printed boards which has silicon units and comprises a polyimide resin and an epoxy resin. The film may contain, if necessary, an epoxy resin curing agent and a polyimide resin structure may have a functional group reactive with the epoxy resin. It is used by inter...

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Bibliographische Detailangaben
Hauptverfasser:	OHMORI, FUMIHIRO, SHIMOSE, MAKOTO, OHKUBO, MISAO, NAKAJIMA, KENJI, YUASA, MASATOSHI, 104, GREEN HILL KAMOI I, WADA, YUKIHIRO, WADA, KEIICHIROU
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A heat-resistant adhesive film for printed boards which has silicon units and comprises a polyimide resin and an epoxy resin. The film may contain, if necessary, an epoxy resin curing agent and a polyimide resin structure may have a functional group reactive with the epoxy resin. It is used by interposing between the adherents and applying a pressure of 1-1,000 kg/cm at a temperature of 20-250 DEG C. This film is excellent in heat resistance, wet soldering-heat resistance and processability under a thermal pressing condition below 250 DEG C.